PART |
Description |
Maker |
1490 |
High Power Termination
|
API Technologies Corp
|
137-760-6 75-137-760-X 75-760-6 |
OUTLINE, WR75 VERY HIGH POWER TERMINATION
|
Advanced Technical Materials Inc.
|
750-745-C1 750-745-C2 750-745-C3 750-745-G1 750-74 |
OUTLINE, WRD750 TERMINATION, HIGH POWER
|
Advanced Technical Materials Inc.
|
PE6105 |
7/16 MALE HIGH POWER TERMINATION FREQUENCY RANGE: DC TO 7 GHz
|
Pasternack Enterprises, Inc.
|
AD8016ARE-EVAL AD8016ARB-EVAL AD8016ARB-REEL AD801 |
Low Power, High Output Current xDSL Line Driver ER 6C 4#16 2#8 PIN RECP WALL Circular Connector; No. of Contacts:5; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:22; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No Low Power/ High Output Current xDSL Line Driver Low Power, High Output Current xDSL Line Driver DUAL OP-AMP, 3000 uV OFFSET-MAX, PDSO20
|
Analog Devices, Inc. http://
|
OL3204N-40 OL3201N-40 |
FIBER OPTIC LASER DIODE MODULE EMITTER, 1280-1330nm, THROUGH HOLE MOUNT, FC CONNECTOR 1.3 レm High-Power Laser-Diode DIP Module 1.3レ米高功率激光二极管双酯模块 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle 1.3レ米高功率激光二极管双酯模块 1.3 μm High-Power Laser-Diode DIP Module 1.3 m High-Power Laser-Diode DIP Module
|
LAPIS SEMICONDUCTOR CO LTD OKI SEMICONDUCTOR CO., LTD. OKI[OKI electronic componets] OKI electronic components
|
PACNLT101Q PACNLT101 |
NON-LINEAR HIGH SPEED TERMINATION IC
|
CALMIRCO[California Micro Devices Corp]
|
APT1001R6BN |
Circular Connector; No. of Contacts:56; Series:MS27656; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No N-CHANNEL ENHANCEMENT MODE HIGH VOLTAGE POWER MOSFETS POWER MOS IV 1000V 8.0A 1.60 Ohm
|
Advanced Power Technology Ltd. ADPOW[Advanced Power Technology]
|
HDT26PD HDT26SD HDT78PD HDT78SD |
HIGH DENSITY D-SUB SOLDER CUP TERMINATION
|
Adam Technologies, Inc.
|